United States. Patent Office · Washington, D.C., Govt. Print. Off. · leaf 429
k like portion being of greatestthickness at the periphery of said cuppedportion and thence gradually decreasing in 70thiclaiess and tapering to the periphery ofsaid disk-like portion which is of least andwafer like thickness. In testimony whereof, I have hereuntoaffixed my signature in the…
Phonograph · Patents
Internet Archive · Smithsonian Libraries · Public Domain Mark 1.0. Free to use for anything.
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